Team Lead Co-Packaged Optics (m/f/d) in Stuttgart, Deutschland

Your mission

The future of AI computing is light, not electrons.

https://jobeax.com/link/D17z7M5TfSZ3qCXe is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As our  Team Lead Co-Packaged Optics , you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build, coach, and scale a brand-new CPO Packaging Team from the ground up, driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing.

Your Responsibilities 

• Leadership & Team  Architecture :   Build , mentor,  and  disciplinarily  lead  a high-performing  CPO  Packaging  engineering  team ;  execute  gap  analyses  and  strategic  hiring  to  accelerate  our  scaling  roadmap .
• OSAT & Supply Chain Mastery: Own the evaluation, qualification, and end-to-end technical management of global OSAT partners, ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months. 
• Technical Ownership (CPO & Fiber Attach): Drive the development of advanced co-packaged photonic/electronic assemblies, mastering deep hardware challenges across optical fiber coupling (Edge Coupling, FAUs), advanced packaging materials, and high-performance thermal management. 
• Design for Excellence (DFM): Bridge the gap between engineering and mass manufacturing by implementing strict Design for Manufacturability (DFM) guidelines and ensuring reliability qualification under JEDEC and Telcordia standards.
• Cross-Functional Synergy: Act as the critical interface between internal Chip Design, Systems, Manufacturing, Test, and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll-out. 
• Continuous Engineering Quality: Champion rigorous root-cause analysis utilizing structured frameworks (8D, FMEA, Ishikawa) to rapidly resolve unexpected reliability or process deviations. 

Your profile

• Academic Foundation: You hold a Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.
• Semiconductor & OSAT Expertise:  You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment), with a proven track record in global supplier evaluation.
• CPO & Precision Hands-on Skills:  You have direct, hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs). 
• Leadership & Empowerment:  You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability. 
• Analytical Self-Leadership: You thrive in high-growth, innovative environments, demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.
• Communication Excellence:  You possess exceptional written and verbal communication skills; fluency in English is required. Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders. 

Why us?

• We hire for attitude   and train for skills.

• We encourage self-responsibility   and accelerate professional development.

• We move fast   and encourage experimentation.

• You have the opportunity   to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.

• You can be part of   a passionate international, highly skilled cross-functional team.

• You will have access   to the founders of the company.

About us

Who we are and what we do

https://jobeax.com/link/D17z7M5TfSZ3qCXe is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC applications. In collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS, https://jobeax.com/link/D17z7M5TfSZ3qCXe operates its own pilot line for photonic chips, based on the material system Thin-Film Lithium Niobate TFLN. https://jobeax.com/link/D17z7M5TfSZ3qCXe was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart, Germany.